US Patent Issued to Hitachi Energy on April 15 for "Power semiconductor module with injection-molded or laminated cooler assembly" (Swiss Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,163, issued on April 15, was assigned to Hitachi Energy Ltd (Zurich, Switzerland).

"Power semiconductor module with injection-molded or laminated cooler assembly" was invented by Niko Pavlicek (Zurich, Switzerland), Lluis Santolaria (Olten, Switzerland), Dominik Truessel (Bremgarten, Switzerland) and Helder Mata (Baden, Switzerland).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling assembly includes a first cooler part having an opening and an attachment point arranged on a first side of the first cooler part. The opening is configured to receive an integrated cooling structure of a corresponding semiconductor module that includes a baseplate t...