US Patent Issued to HISAMITSU PHARMACEUTICAL on May 13 for "Method for producing adhesive layer composition for producing cooling sheet, method for producing cooling sheet, and cooling sheet" (Japanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,297,380, issued on May 13, was assigned to HISAMITSU PHARMACEUTICAL Co. INC. (Tosu, Japan).

"Method for producing adhesive layer composition for producing cooling sheet, method for producing cooling sheet, and cooling sheet" was invented by Kentaro Nakashima (Tosu, Japan), Kento Ichinohe (Tosu, Japan), Keiichiro Tsurushima (Tosu, Japan) and Takaaki Yoshinaga (Tosu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for producing an adhesive layer composition for producing a cooling sheet including a backing layer, an adhesive layer, and a liner layer, the method comprising the step of: mixing a composition to be mixed containing water, an alu...