US Patent Issued to HIRATA on Aug. 12 for "Solder cutting device, solder cutting unit, part mounting device, and production system" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,383,971, issued on Aug. 12, was assigned to HIRATA Corp. (Kumamoto, Japan).

"Solder cutting device, solder cutting unit, part mounting device, and production system" was invented by Toshiomi Ikeda (Kumamoto, Japan) and Tetsunori Matsuyoshi (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solder cutting device includes a first holding part, a first drive part that feeds a tape-like solder material held by the first holding part in a first direction, a cutting part for cutting the tape-like solder material, and a second drive part that actuates the cutting part. The first drive part is a first actuator that is electrically-driven and that...