US Patent Issued to HIGH TECHNOLOGY on July 1 for "Air-core transformer package with ferrite electro-magnetic interference (EMI) shielding of integrated-circuit (IC) chip" (Chinese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,789, issued on July 1, was assigned to HIGH TECHNOLOGY Ltd. (Hong Kong, Hong Kong).

"Air-core transformer package with ferrite electro-magnetic interference (EMI) shielding of integrated-circuit (IC) chip" was invented by Chik Wai (David) Ng (Hong Kong, Hong Kong), Kwun Yuan (Godwin) Ho (Hong Kong, Hong Kong), Ki Hin (Gary) Choi (Hong Kong, Hong Kong), Tin Ho (Andy) Wu (Hong Kong, Hong Kong) and Wai Kit (Victor) So (Hong Kong, Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "An Integrated Circuit (IC) package has a ferrite-dielectric shield between planar transformer coils and a semiconductor chip. The shield blocks Electro-Magnetic Interfere...