US Patent Issued to HICON on March 11 for "Lidless BGA socket apparatus for testing semiconductor device" (South Korean, American Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,248,001, issued on March 11, was assigned to HICON Co. LTD. (Seongnam-si, South Korea).

"Lidless BGA socket apparatus for testing semiconductor device" was invented by Dong Weon Hwang (Gyeonggi-do, South Korea), Logan Jae Hwang (Flower Mound, Texas) and Jae Baek Hwang (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a BGA socket apparatus which is a lidless-type from which a cover, generally provided on the top part of a socket body in order for the loading/unloading operation of an IC, is removed, the BGA socket apparatus enabling the elimination of elements which may obstruct air flow during testing....