US Patent Issued to Hewlett Packard Enterprise Development on Sept. 30 for "Conforming heat transport device for dual inline memory module cooling applications" (American, Turkish Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,884, issued on Sept. 30, was assigned to Hewlett Packard Enterprise Development LP (Spring, Texas).

"Conforming heat transport device for dual inline memory module cooling applications" was invented by Ernesto Ferrer Medina (Aguadilla, Turkey), Harvey J. Lunsman (Chippewa Falls, Wis.), Tahir Cader (Liberty Lake, Wash.) and John Franz (Houston).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board cooling apparatus is disclosed having a heat spreader device to be thermally coupled with a surface of the circuit board to be cooled. Also, a conforming heat transfer device is disclosed that is thermally and physically coupled with the heat sprea...