US Patent Issued to Hewlett Packard Enterprise Development on Sept. 2 for "Elastomer embedded multipoint contact cooling" (Wisconsin Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,408,303, issued on Sept. 2, was assigned to Hewlett Packard Enterprise Development LP (Spring, Texas).

"Elastomer embedded multipoint contact cooling" was invented by Harvey J. Lunsman (Chippewa Falls, Wis.) and Steven Dean (Chippewa Falls, Wis.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Example implementations relate to a cooling assembly of a host circuit device, a circuit assembly including the host circuit device and a removable circuit device, and a method for thermal management of the removable circuit device removably connected to the host circuit device. The cooling assembly includes a cooling component and a thermal gap pad having an elasto...