US Patent Issued to Hewlett Packard Enterprise Development on Oct. 7 for "Cooling module for a circuit module having a plurality of chipsets" (Puerto Rico Inventor)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,552, issued on Oct. 7, was assigned to Hewlett Packard Enterprise Development LP (Spring, Texas).

"Cooling module for a circuit module having a plurality of chipsets" was invented by Ernesto Ferrer Medina (Aguadilla, Puerto Rico).

According to the abstract* released by the U.S. Patent & Trademark Office: "Example implementations relate to a cooling module, a circuit assembly having one or more circuit modules and the cooling module, and a method of forming the cooling module. The cooling module includes a first cooling component and a second cooling component disposed on the first cooling component. The first cooling component includes a plurality of microchannel blocks thermally ...