US Patent Issued to Hewlett Packard Enterprise Development on Oct. 28 for "Removable OCP module with PCIe slots" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,457,700, issued on Oct. 28, was assigned to Hewlett Packard Enterprise Development LP (Spring, Texas).

"Removable OCP module with PCIe slots" was invented by Chui Ching Chiu (Taoyuan, Taiwan), Chih-Wei Chiang (Taoyuan, Taiwan) and Hsueh-Yu Chao (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A removable module, a system and a method. The removable module comprising a PCB having an OCP NIC form factor, an OCP edge connector comprising a plurality of pins on an edge of the PCB, wherein the OCP edge connector is configured to mate with an OCP board connector of a primary system board of the computing system in an installed state of the remov...