US Patent Issued to Hewlett Packard Enterprise Development on May 20 for "Receptacle with connectable spring finger for multipoint contact conduction cooling" (Oregon, Wisconsin, Texas Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,969, issued on May 20, was assigned to Hewlett Packard Enterprise Development LP (Spring, Texas).

"Receptacle with connectable spring finger for multipoint contact conduction cooling" was invented by Harvey J. Lunsman (Chippewa Falls, Wis.), Ernesto Ferrer (Aguadilla, Ore.) and John Franz (Houston).

According to the abstract* released by the U.S. Patent & Trademark Office: "Example implementations relate to an electronic system providing thermal management of a removable device when connected to a host device of the electronic system including a receptacle, and a heat transfer device having first and second portions. The host device has a cooling component. The removable device h...