US Patent Issued to Hewlett Packard Enterprise Development on June 17 for "Variable flow liquid-cooled cooling module" (Wisconsin, Washington Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,138, issued on June 17, was assigned to Hewlett Packard Enterprise Development LP (Spring, Texas).

"Variable flow liquid-cooled cooling module" was invented by Harvey J. Lunsman (Chippewa Falls, Wis.) and Tahir Cader (Liberty Lake, Wash.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Example implementations relate to a cooling module, and a method of cooling an electronic circuit module. The cooling module includes first and second cooling components fluidically connected to each other. The first cooling component includes a first fluid channel having supply, return, and body sections, and a second fluid channel. The second cooling component include...