US Patent Issued to Hewlett Packard Enterprise Development on Jan. 13 for "AC-coupling structure in electrical cabled interconnect" (Colorado Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,375, issued on Jan. 13, was assigned to Hewlett Packard Enterprise Development LP (Spring, Texas).

"AC-coupling structure in electrical cabled interconnect" was invented by Karl J. Bois (Fort Collins, Colo.), James David Stewart (Fort Collins, Colo.), David P. Kopp (Fort Collins, Colo.) and Elene Chobanyan (Fort Collins, Colo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A signal cable for an AC-coupled link, may include: a signal conductor; a dielectric surrounding the signal conductor; and a ground sheath having a conductive layer disposed at least partially around the conductor such that the dielectric is positioned between the ground sheath an...