ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,251, issued on Aug. 26, was assigned to Hewlett Packard Enterprise Development LP (Spring, Texas).
"Power via resonance suppression" was invented by Melvin Kent Benedict (Magnolia, Texas), Chi Kim Sides (Spring, Texas), Paul Danna (Pearland, Texas) and Michael Chan (Bellaire, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "One aspect provides a printed circuit board (PCB). The PCB can include a plurality of layers and a plurality of plated through-hole (PTH) vias extending through the plurality of layers. The plurality of layers can include at least a top layer for mounting components, a second surface layer, and a first power layer positioned ...