ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,504, issued on June 24, was assigned to Hewlett-Packard Deveopment Co. LP (Spring, Texas).
"Thermal management devices" was invented by Hendry Huang (Taipei, Taiwan), Kuan-Ting Wu (Taipei, Taiwan) and Chi Hao Chang (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure describes thermal management devices. In one example, a thermal management device can include a processing unit, a thermal grease layer directly contacting the processing unit, and a heat pipe. The heat pipe can include a heat pipe interior volume having a working fluid disposed therein, a first exterior surface directly contacting the thermal grease lay...