US Patent Issued to Hewlett-Packard Development on Nov. 4 for "Substrate coated with a thermal management material" (Taiwanese, Indian Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,460,089, issued on Nov. 4, was assigned to Hewlett-Packard Development Co. LP (Spring, Texas).

"Substrate coated with a thermal management material" was invented by Shreenath Anandakrishnan (Bangalore, India) and Kuan-Ting Wu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Herein is described a substrate coated with a thermal management material for an electronic device, wherein the thermal management material comprises: a thermal conductive coat deposited on the substrate; and a heat insulation coat deposited on the thermal conductive coat, wherein the heat insulation coat comprises a plant root powder and a resin. A process for coating t...