ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,678, issued on Nov. 18, was assigned to Hewlett-Packard Development Co. LP (Spring, Texas).
"Processor back-plate devices" was invented by Fu-Yi Chen (Taipei, Taiwan) and Jui-Ming Chien (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "In some examples, a device can include a locking mechanism to couple the device to a computing device enclosure, a first portion at a first level to interact with a processor back-plate, and a second portion at a second level to interact with an area proximate to the processor back-plate, wherein the second portion protrudes to the second level toward the processor back-plate when the device is coupled to...