US Patent Issued to Hewlett-Packard Development on Nov. 11 for "Heat conduction member for preventing fuser heater from local overheating" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,468,246, issued on Nov. 11, was assigned to Hewlett-Packard Development Co. LP (Spring, Texas).

"Heat conduction member for preventing fuser heater from local overheating" was invented by Sunhyung Lee (Seongnam-si, South Korea) and Hojin Ryu (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An example fuser includes a flexible fusing belt, a backup member located outside the fusing belt to form a fusing nip with the fusing belt, a heater substrate having a first surface including a heating element pattern and a second surface, opposite to the first surface, to heat the fusing belt in the fusing nip, and a heat conduction member in...