ALEXANDRIA, Va., March 26 -- United States Patent no. 12,257,624, issued on March 25, was assigned to Hewlett-Packard Development Co. LP (Spring, Texas).
"Powder bed materials" was invented by John Samuel Dilip Jangam (Palo Alto, Calif.), Thomas Anthony (Palo Alto, Calif.), Krzysztof Nauka (Palo Alto, Calif.) and Kristopher J. Erickson (Palo Alto, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A powder bed material can include from 80 wt % to 100 wt % metal particles having a D50 particle size distribution value from 4 micro metre to 150 micro metre. From 10 wt % to 100 wt % of the metal particles can be surface-activated metal particles having in intact inner volume and an outer volume with structura...