US Patent Issued to Hewlett-Packard Development on March 18 for "Spatial arrangements of objects for additive manufacturing" (Spanish Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,251,881, issued on March 18, was assigned to Hewlett-Packard Development Co. LP (Spring, Texas).

"Spatial arrangements of objects for additive manufacturing" was invented by Serigo Gonzalez Martin (Sant Cugat del Valles, Spain), Manuel Freire Garcia (Sant Cugat del Valles, Spain) and Ismael Fernandez Aymerich (Sant Cugat del Valles, Spain).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an example, a method includes obtaining a compensation model characterising a relationship between a location of an object within a fabrication chamber of an additive manufacturing apparatus and a geometrical compensation to be applied to a model of said object, wherei...