ALEXANDRIA, Va., June 25 -- United States Patent no. 12,339,293, issued on June 24, was assigned to Hewlett-Packard Development Co. LP (Spring, Texas).
"Identifying substrate waste sites" was invented by Joshua M. Yu (Corvallis, Ore.), Angela Bakkom (Corvallis, Ore.) and Christopher Hans Bakker (Corvallis, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "In one example in accordance with the present disclosure, a system is described. The system includes a fluidic die to advance across an ejection path relative to a substrate. The fluidic die includes a channel to contain a portion of a sample fluid, a sensor to detect passage of a particle within the sample fluid into the channel, and an ejection device. ...