ALEXANDRIA, Va., June 25 -- United States Patent no. 12,339,714, issued on June 24, was assigned to Hewlett-Packard Development Co. LP (Spring, Texas).
"Housings for electronic devices" was invented by Chi Hao Chang (Taipei, Taiwan), Hendry Huang (Taipei, Taiwan) and Kuan-Ting Wu (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is drawn to housings for electronic devices. In one example, a housing for an electronic device can include a rigid substrate having an exterior surface including a recessed region positioned at an opening extending through the rigid substrate connecting the recessed region to an interior surface of the rigid substrate. A conductive metal antenna i...