US Patent Issued to Hewlett-Packard Development on Feb. 25 for "Fluidic die having trickle-warming and pulse-warming circuits" (Oregon, California Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,233,645, issued on Feb. 25, was assigned to Hewlett-Packard Development Co. LP (Spring, Texas).

"Fluidic die having trickle-warming and pulse-warming circuits" was invented by Eric Thomas Martin (Corvallis, Ore.), Garrett E. Clark (Corvallis, Ore.), Jeremy Spencer (Corvallis, Ore.), Vincent C. Korthuis (Corvallis, Ore.) and Rogelio Cicili (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A fluidic die includes fluid-transfer elements, and a temperature sensor to monitor a temperature on the fluidic die. The fluidic die includes a trickle-warming circuit to warm fluid transferrable by the fluid-transfer elements, and a pulse-warming circuit to wa...