US Patent Issued to Hewlett-Packard Development on Dec. 9 for "Corrosion tolerant micro-electromechanical fluid ejection device" (Oregon Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,491,716, issued on Dec. 9, was assigned to Hewlett-Packard Development Co. LP (Spring, Texas).

"Corrosion tolerant micro-electromechanical fluid ejection device" was invented by Stanley J. Wang (Corvallis, Ore.) and Anthony M. Fuller (Corvallis, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of the present disclosure are directed to an apparatus including a circuit region and a fluidic region. In a particular example, the circuit region with logical circuits thereon, includes a thermal oxide layer on a silicon substrate, and a dielectric layer over the field oxide layer, the dielectric layer including a doped dielectric film. The microfluidi...