ALEXANDRIA, Va., April 9 -- United States Patent no. 12,270,820, issued on April 8, was assigned to Hewlett-Packard Development Co. LP (Spring, Texas).
"Ejection subassembly pitches to match nanowell spacing" was invented by Jeffrey A. Nielsen (Corvallis, Ore.), Christie Dudenhoefer (Corvallis, Ore.), Debora J. Thomas (Corvallis, Ore.), Roberto A Pugliese (Corvallis, Ore.) and Diane R. Hammerstad (Corvallis, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a plurality of ejection subassemblies. Each ejection subassembly includes an ejection chamber to hold a volume of fluid and an opening through...