ALEXANDRIA, Va., June 16 -- United States Patent no. 12,305,306, issued on May 20, was assigned to Heraeus Materials Singapore Pte. Ltd. (Singapore).
"Coated round wire" was invented by Miew Wan Lo (Singapore), Murali Sarangapani (Singapore) and Yong Sheng Wang (Singapore).
According to the abstract* released by the U.S. Patent & Trademark Office: "A round wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself is a silver-based wire core, wherein the coating layer is a double-layer comprised of a 1 to 100 nm thick inner layer of palladium or nickel and an adjacent 1 to 250 nm thick outer layer of gold, wherein the outer layer of gold exhibits at least one ...