US Patent Issued to Henkel on Oct. 21 for "Heat separable two-layer adhesive system and process of adhesive debonding using the same" (German Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,448,547, issued on Oct. 21, was assigned to Henkel AG & Co. KGaA (Duesseldorf, Germany).

"Heat separable two-layer adhesive system and process of adhesive debonding using the same" was invented by Uwe Franken (Dormagen, Germany), Hans-Georg Kinzelmann (Pulheim, Germany), Andreas Ferencz (Duesseldorf, Germany) and Stefanie Stapf (Essen, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a heat separable two-layer adhesive system, to a process of adhesive debonding using the adhesive system and to a heat separable bonded composite body. In particular, the present invention relates to a heat separable two-layer adhesive...