ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,441,881, issued on Oct. 14, was assigned to Henkel AG & Co. KGaA (Duesseldorf, Germany).
"Thermal interface materials" was invented by Chunyong Wu (Plymouth, Minn.), John Timmerman (Minneapolis), Reid Chesterfield (Eden Prairie, Minn.) and Radesh Jewram (Lakeville, Minn.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thermally conductive curable composition includes a first part and a second part, wherein the first part comprises a catalyst, a ceramic filler mixture, a low volatile organic liquid, and water, and the second part comprises a silyl modified reactive polymer, a low volatile organic liquid, and the ceramic filler mixture, and the low volat...