ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,023, issued on Nov. 25, was assigned to HENKEL AG & Co. KGaA (Duesseldorf, Germany).
"Hot-melt adhesive" was invented by Ai Takamori (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A hot-melt adhesive having reduced thread formation at the time of applying, excellent thermal resistance and thermal stability after bonding. A hot-melt adhesive comprising a copolymer of ethylene and olefins having 3 to 20 carbon atoms (A), a copolymer of ethylene and carboxylate esters having ethylenically unsaturated double bonds (B), a tackifying resin (C) and a wax (D), wherein the copolymer of ethylene and at least one olefin monomer having 3 to 20 car...