ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,129, issued on Nov. 18, was assigned to HENKEL AG & Co. KGaA (Duesseldorf, Germany).
"Film-wrapped type hot melt adhesive" was invented by Takeshi Kiyohara (Osaka, Japan), Shigekazu Saito (Osaka, Japan) and Takanori Okuda (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a film-wrapped type hot melt adhesive, comprising: a film made from a thermoplastic resin composition and a hot melt adhesive wrapped by the film, wherein the thermoplastic resin composition comprises an ethylene homopolymer, and a concavo-convex is formed on a surface of the film. The film-wrapped type hot melt adhesive has blocking resistance and thermal st...