ALEXANDRIA, Va., June 25 -- United States Patent no. 12,338,342, issued on June 24, was assigned to Henkel AG & Co. KGaA (Duesseldorf, Germany).
"One component (1K) composition based on epoxy resin" was invented by Chunfu Chen (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention is directed to an one-component (1K) composition comprising, based on the weight of the composition: from 30 to 90 wt. % of a) at least one epoxy resin; from 1 to 50 wt. % of b) at least one mercapto compound having at least two mercapto groups reactive towards epoxide; from 0.5 to 25 wt. % of c) at least one organoboron compound selected from tetrasubstituted borate salts of monovalent cations of ter...