ALEXANDRIA, Va., June 18 -- United States Patent no. 12,325,213, issued on June 10, was assigned to HENKEL AG & Co. KGaA (Duesseldorf, Germany).
"Method for producing a multi-layer substrate" was invented by Roland Bochnia (Hilden, Germany), Stefan Strenger (Heiligenhaus, Germany), Rainer Bongers (Frankfurt, Germany) and Mario Eckers (Wegberg, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a method for producing a multi-layer substrate, said substrate comprising a multifunctional coating, and to the use of the substrate produced by this method."
The patent was filed on Oct. 26, 2023, under Application No. 18/494,859.
*For further information, including images, chart...