ALEXANDRIA, Va., July 3 -- United States Patent no. 12,344,739, issued on July 1, was assigned to Henkel AG & Co. KGaA (Duesseldorf, Germany).
"Conductive epoxy resin composition for copper bonding" was invented by Yang Ti (Shanghai), Wei Yao (Shanghai), Qili Wu (Shanghai) and Jiawen Zhao (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "This invention relates to a conductive epoxy resin composition, in particular for bonding copper substrate, and the cured product, and the use thereof as well as a semiconductor device comprising the cured product."
The patent was filed on Jan. 13, 2023, under Application No. 18/096,648.
*For further information, including images, charts and tables, please visit: ht...