ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,497,505, issued on Dec. 16, was assigned to Henkel AG & Co. KGaA (Duesseldorf, Germany).
"One component (1K) composition based on modified epoxy resin" was invented by Chunfu Chen (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention is directed to an one component (1K) composition comprising: a) at least one epoxy resin; b) at least one internally flexibilized epoxy resin which is characterized by a Shore D hardness, as measured with a durometer in accordance with ASTM D2240, of less than equal to45 when cured with diethylene triamine; c) core shell rubber particles; d) a curative which consists of at least one compound ...