ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,384,099, issued on Aug. 12, was assigned to Henkel AG & Co. KGaA (Duesseldorf, Germany).
"Dual cure epoxy formulations for 3D printing applications" was invented by Sascha Poeller (Duisburg, Germany), Tanja Rossberg (Haan, Germany), Ligang Zhao (Duesseldorf, Germany), Andreas Ferencz (Duesseldorf, Germany), Manuel Schiel (Duesseldorf, Germany) and Tim Welters (Hilden, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention lies in the field of 3D printing methods. In particular, the invention relates to 3D printing methods for the production of a 3D part in a layer-by-layer manner, wherein the printable composition is a pasty epoxy ...