US Patent Issued to HELIATEK on Oct. 7 for "Encapsulation system for an optoelectronic component comprising at least a first encapsulation and a second encapsulation, and optoelectronic component comprising an encapsulation system of this kind" (German Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,766, issued on Oct. 7, was assigned to HELIATEK GMBH (Dresden, Germany).

"Encapsulation system for an optoelectronic component comprising at least a first encapsulation and a second encapsulation, and optoelectronic component comprising an encapsulation system of this kind" was invented by Merve Anderson (Dresden, Germany), Michael Eritt (Dresden, Germany), Judith Geoerg (Dresden, Germany), Michael Meissner (Dresden, Germany) and Ralph Wichtendahl (Dresden, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "An encapsulation system, including a first encapsulation formed from at least one front barrier layer on a front face of the optoelectronic c...