US Patent Issued to Hefei Xiasheng Optoelectronics Technology, Beijing BOE Technology Development on Nov. 25 for "Method of fabricating array substrate with testing pins" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,710, issued on Nov. 25, was assigned to Hefei Xiasheng Optoelectronics Technology Co. Ltd. (Anhui, China) and Beijing BOE Technology Development Co. Ltd. (Beijing).

"Method of fabricating array substrate with testing pins" was invented by Yu Ai (Beijing), Xuewu Xie (Beijing), Bowen Liu (Beijing), Yubao Kong (Beijing), Shi Sun (Beijing), Hao Liu (Beijing) and Ameng Zhang (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating an array substrate is provided. The method includes providing a substrate including a gate pad configured to bond a gate driving integrated circuit, a data pad configured to bond a data driving integrated...