US Patent Issued to HEFEI BOE RUISHENG TECHNOLOGY, BOE TECHNOLOGY GROUP on May 13 for "Light-emitting substrate and manufacturing method thereof, backlight module and display apparatus" (Chinese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,298,621, issued on May 13, was assigned to HEFEI BOE RUISHENG TECHNOLOGY Co. LTD. (Anhui, China) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Light-emitting substrate and manufacturing method thereof, backlight module and display apparatus" was invented by Bing Zhang (Beijing), Jianwei Qin (Beijing), Xiao Wang (Beijing), Kangli Wang (Beijing) and Liang Gao (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light-emitting substrate includes a circuit board, a plurality of light-emitting devices, a reflective layer and a support layer. The plurality of light-emitting devices are disposed on the circuit board. The reflective layer is disposed on th...