US Patent Issued to Hefei BOE Ruisheng Technology, BOE Technology Group on Jan. 27 for "Wiring substrates and electronic apparatuses" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,413, issued on Jan. 27, was assigned to Hefei BOE Ruisheng Technology Co. Ltd. (Anhui, China) and BOE Technology Group Co. Ltd. (Beijing).

"Wiring substrates and electronic apparatuses" was invented by Jiawei Xu (Beijing), Zouming Xu (Beijing), Xintao Wu (Beijing) and Yajun Ma (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a wiring substrate and an electronic apparatus. The wiring substrate includes a substrate and a shielding signal line disposed on the substrate. The substrate includes a functional region; the functional region is provided with a plurality of pad groups; the plurality of pad groups are dist...