US Patent Issued to HEFEI BOE OPTOELECTRONICS TECHNOLOGY, BOE TECHNOLOGY GROUP on Jan. 27 for "Backplane and method for manufacturing the same, backlight module, and display apparatus" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,853, issued on Jan. 27, was assigned to HEFEI BOE OPTOELECTRONICS TECHNOLOGY Co. LTD. (Hefei, China) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Backplane and method for manufacturing the same, backlight module, and display apparatus" was invented by Hai Tang (Beijing), Xiaolin Geng (Beijing), Liang Gao (Beijing), Shubai Zhang (Beijing) and Jianwei Qin (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A backplane includes a substrate, a circuit structure layer, a reflective layer, a plurality of electronic devices and a plurality of encapsulation portions. Each encapsulation portion covers an electronic device in the plurality of electronic ...