ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,984, issued on May 6, was assigned to Hebei Beixin Semiconductor Technology Co. Ltd. (Shijiazhuang, China).
"Method for packaging stacking flip chip" was invented by Honglei Ran (Shijiazhuang, China), Kui Zhang (Shijiazhuang, China), Shanbin Xi (Shijiazhuang, China), Hao Peng (Shijiazhuang, China), Huaguang Liu (Shijiazhuang, China) and Hailong Zhao (Shijiazhuang, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present application is applicable to the field of semiconductor technology and provides a method for packaging stacking a flip chip, which includes: placing a filling template on a substrate, the filling template being provided with ...