US Patent Issued to HD MICROSYSTEMS on Aug. 12 for "Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,386,256, issued on Aug. 12, was assigned to HD MICROSYSTEMS LTD. (Tokyo).

"Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component" was invented by Atsutaro Yoshizawa (Hitachi, Japan), Satoshi Yoneda (Hitachi, Japan), Akira Asada (Hitachi, Japan), Masayuki Ohe (Hitachi, Japan) and Tetsuya Enomoto (Hitachi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A photosensitive resin composition comprises a polyimide precursor having a polymerizable unsaturated bond; one or more compounds represented by any of the following formu...