US Patent Issued to HC Semitek (Zhejiang) on Feb. 10 for "Flip light emitting diode chip and manufacturing method therefor" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,492, issued on Feb. 10, was assigned to HC Semitek (Zhejiang) Co. Ltd. (Zhejiang, China).

"Flip light emitting diode chip and manufacturing method therefor" was invented by Ye Lan (Jiangsu, China), Lei Huang (Jiangsu, China), Wei Zhang (Jiangsu, China), Zhihao Wu (Jiangsu, China) and Peng Li (Jiangsu, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "This application is directed to a flip light emitting diode chip and a manufacturing method therefor. Said chip comprises a substrate, an N-type semiconductor layer, an active layer, a P-type semiconductor layer, a transparent conductive layer, a transparent insulating layer, a reflective electrode, ...