US Patent Issued to Harman International Industries on Oct. 7 for "Multi-stage structure-borne sound and vibration sensor" (Hungarian, American Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,436,025, issued on Oct. 7, was assigned to Harman International Industries Inc. (Stamford, Conn.).

"Multi-stage structure-borne sound and vibration sensor" was invented by Darin Krajewski (White Lake, Mich.), Yu Du (Chicago), Peter Atilla Kardos (Budapest, Hungary) and Florian Czinege (Budapest, Hungary).

According to the abstract* released by the U.S. Patent & Trademark Office: "In at least one embodiment, a multi-stage sound and vibration sensor is provided. The multi-stage sound and vibration sensor includes a housing, a first piezo-diaphragm and a second piezo diaphragm. The first piezo-diaphragm and the second piezo-diaphragm are positioned in the housing to detect an input signa...