US Patent Issued to Harman International Industries on Oct. 7 for "Micro-electro-mechanical systems (MEMS) microphone assembly" (Michigan Inventor)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,188, issued on Oct. 7, was assigned to Harman International Industries Inc. (Stamford, Conn.).

"Micro-electro-mechanical systems (MEMS) microphone assembly" was invented by Yu Du (Novi, Mich.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In at least one embodiment, a microphone assembly including an enclosure, a first printed circuit board (PCB) and a microphone assembly is provided. The microphone assembly includes a sub-casing, a micro-electro-mechanical systems (MEMS) transducer, and a second PCB. The MEMS transducer positioned in the sub-casing and the second PCB supports the MEMS transducer. The first PCB defines a first acoustic path positione...