US Patent Issued to Harman International Industries on Oct. 21 for "Modular audio assembly for use with vehicle headrest" (Michigan, Alabama, Connecticut Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,452,569, issued on Oct. 21, was assigned to Harman International Industries Inc. (Stamford, Conn.).

"Modular audio assembly for use with vehicle headrest" was invented by Gerhard Doberstein (Stamford, Conn.), Riley Winton (Opelika, Ala.), David Mossington (Rochester, Mich.), Christopher Ludwig (Bloomfield Hills, Mich.) and Rui Edson Justino De Oliveira (Rochester, Mich.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A modular audio assembly for use with a vehicle headrest includes a speaker assembly including a support member arranged to be rotatably mounted to the vehicle headrest, and a speaker module coupled to the support member, the speaker module ...