US Patent Issued to Harman International Industries on Nov. 11 for "Mounting structure for mounting an electronic device" (American, Chinese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,466,330, issued on Nov. 11, was assigned to Harman International Industries Inc. (Stamford, Conn.).

"Mounting structure for mounting an electronic device" was invented by Jianing Chen (Northville, Mich.), David Jia (Canton, Mich.) and Fan Wu (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A mounting structure includes base wall formed of a thermally conductive material and configured to provide a thermally conductive pathway between an electronic device mounted to an inner side of the base wall and a panel in contact with an outer side of the base wall that is opposite the inner side. The outer side includes a plurality of bumps configured to e...