ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,231,870, issued on Feb. 18, was assigned to Harman International Industries Inc. (Stamford, Conn.).
"Enhanced headphone design using DSP and array technology" was invented by Ulrich Horbach (Oberschneiding, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A headphone arrangement includes two earphones, wherein each earphone comprises a housing encompassing a low-frequency transducer and an array of at least three high-frequency transducers. The low-frequency transducer of each earphone is disposed on or over an ear canal of a user when the earphone is worn by the user, and is configured to broadcast low-frequency sound that corresponds to low-freq...