ALEXANDRIA, Va., Aug. 6 -- United States Patent no. D1,087,069, issued on Aug. 5, was assigned to Harman International Industries Inc. (Northridge, Calif.).
"Electronic device cover" was invented by Jiacheng Yu (Shenzhen, China) and Dario Distefano (Amsterdam).
The patent was filed on Dec. 15, 2023, under Application No. D/921,219.
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