US Patent Issued to Harbin Institute of Technology on Nov. 25 for "Ultrasonic measurement method for plane stress on the basis of multi-wafer air-coupled transducer" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,913, issued on Nov. 25, was assigned to Harbin Institute of Technology (Harbin, China).

"Ultrasonic measurement method for plane stress on the basis of multi-wafer air-coupled transducer" was invented by Weijia Shi (Harbin, China), Bingquan Wang (Harbin, China), Bo Zhao (Harbin, China) and Jiubin Tan (Harbin, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "An ultrasonic measurement method for plane stress on the basis of a multi-wafer air-coupled transducer relates to the technical field of ultrasonic testing. The method solves problems that a traditional measurement method for plane stress generally computes the plane stress by changing at lea...