US Patent Issued to HANWHA SOLUTIONS on June 24 for "Method for preparing polyamide by anion ring-opening polymerization and polyamide prepared thereby" (South Korean Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,338,323, issued on June 24, was assigned to HANWHA SOLUTIONS Corp. (Seoul, South Korea).

"Method for preparing polyamide by anion ring-opening polymerization and polyamide prepared thereby" was invented by Seung Hoe Do (Daejeon, South Korea), Jin Seo Lee (Seongnam-si, South Korea), Kyung Ho Kwon (Daegu, South Korea), Do Kyoung Kim (Busan, South Korea), Hye Yeon Lee (Seoul, South Korea) and Kyoung Won Yim (Gwangju, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method for preparing a polyamide by an anionic polymerization reaction, wherein lactam, and based on 100 parts by weight of the entire lactam, 0.01 parts by weight to 20 ...